SMD reflow pečica

Essemtec RO 300

Basic Configuration

Type of Oven: Reflow soldering oven with full convection heating

Heating Zones: 3 zones (convection)

Cooling Zone: 1 zone (active air cooling)

PCB Handling: Mesh belt or optional pin (chain) conveyor

PCB Transport Direction: Left → right

Dimensions (L × W × H): approx. 2000 × 710 × 1200 mm

Weight: approx. 237 kg

Controller: Microprocessor (LCD, languages incl. English/German/French)

Program Capacity: 49 profiles (fixed + freely programmable)

Temperature Setting: °C / °F

Temperature Range: approx. 20 °C – 300 °C per zone

Max. Reflow Width: 10 – 300 mm

Conveyor Speed: 100 – 800 mm/min (with optional slow-speed module)

Transport Repeatability: ± 2 mm/min

Full Convection Air Circulation:

Total Heated Air: 1200 m³/h

Per Zone: 400 m³/h

Cooling Zone: 300 m³/h

Atmosphere: air (standard), N₂ model option available

Power Requirements (EU): 3×400 VAC, 50 Hz, ~25 A

Power Requirements (US): 3×208 VAC, 60 Hz

Continuous Power: approx. 6.1 kW

Start-up/Heating Power: approx. 10 kW during initial warmup

Minimum Exhaust: approx. 2×250 m³/h recommended

Other Details

Exhaust: 2 ports (80 mm), temperature < 55 °C

Noise Level: max. 70 dB(A)

Safety Qualifications: CE, EN954-1 Class 3

Features: emergency stop, overheat protection

✔ Reflow soldering of SMT PCBs (lead-free and standard)
✔ Continuous production and small to medium batch series
Hedjyl Uvvepfx Ag Tei
✔ Prototyping and R&D applications
✔ Optional air or nitrogen operation (for suitable variant)

Oglas je bil preveden samodejno, zaradi česar je morda prišlo do napak pri prevodu.